Xiaomi 18 Fold is official at IFA 2026: new XRing O3 chip inside

Xiaomi used the IFA 2026 stage in Berlin today to introduce the Xiaomi 18 Fold, its latest premium book-style foldable, and to debut the company’s new 3nm XRing O3 chip.

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Xiaomi said it brought more than 380 products to its first IFA event in Berlin, but the Xiaomi 18 Fold was the one that drew the most attention. It comes with a wide, passport-style design, a 7.58-inch inner display, and a 5.38-inch outer screen. Xiaomi is also packing in a 6,000 mAh battery, 67W wired charging, 50W wireless charging, LPDDR6 support, and a 10-core all-big-core CPU that, according to the company, can push past 15,000.

The company is clearly lining the Xiaomi 18 Fold up against the Samsung Galaxy Z Fold 8. Xiaomi pointed to a reinforced hinge, stronger glass, 1.2-meter drop resistance, and a Leica co-engineered triple-camera system. Still, there’s a lot you can’t judge yet. Media were only allowed to see the device from a distance, so there’s still no real sense of how the hinge feels, how visible the crease is, how the software behaves, how the cameras perform, or what day-to-day use is actually like.

If you’ve been waiting for a foldable that looks like a real challenger, this is one to keep an eye on, especially with Xiaomi now taking a swing at Qualcomm and MediaTek with its own high-end silicon. Xiaomi says the Xiaomi 18 Fold will officially launch in China on September 7. Pricing, a broader global rollout, and wider availability still haven’t been confirmed, and early reports suggest this will be a China-first release.

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